CMP is a combination of chemical corrosion and mechanical friction. The equipment and consumables used in CMP technology include: polishing machines, polishing pastes,
polishing pads, post-CMP cleaning equipment, polishing terminal testing and process control equipment, waste treatment and testing equipment, etc.

Polishing machine, polishing paste and polishing pad are the three key elements of CMP process, and their performance and matching determine the level of surface leveling
that CAN be achieved by CMP. The granularity of polishing slurry is controlled within 0.5 micron during the process. Lentop series filters provide you with an effective filter approach.